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What we serve For electronics

Thermal management

Thermal management

• High momentum from E-mobility Market
• Highly focus on thermal and electrical   performance

Typical application we serve:
• Thermal interface materials for battery assembly
• Electric motor potting
• Sensor potting

Semiconductor packaging

Semiconductor packaging

• High dynamics in miniaturization  



Typical application we serve:
• Conformal coating
• Underfill / die attach
• Different types of encapsulation

Copper Clad Laminate (CCL)

Copper Clad Laminate (CCL)

• 5G with high frequency demand
• High electrical performance


Typical application we serve:
• Rigid CCL prepreg
• Flexible CCL adhesion

RAW MATERIALS WE SERVE:

Chemistry

What we offer here

Our brand


Silicones

Addition-curing portfolio

Polymer VS, Modifier, VQM,
 Crosslinkers, Catalysts, InhibitorsReactive plasticizers

Condensation-curing portfolio

Polymer OH, Modifier OH,
Catalysts TD 18, Crosslinker OX

Performance compounds for thermal management

TEGOSIL Heatban®, TEGOSIL® FR, TEGOSIL® HT

Functional filler dispersants

TEGOPREN®, TEGOMER®

Silane modified polymers

Silane modified polymers

Polymer ST, TEGOPAC®

Functional filler dispersants

TEGOPREN®, TEGOMER®

Reactive resins

Nanosilica in epoxies, acrylic monomers and solvents

NANOPOX®, NANOCRYL®, NANOPOL®

Core-shell silicone rubber in epoxies and polyol

ALBIDUR® EP, ALBIDUR® PU

Epoxy-silicone block copolymers

ALBIFLEX®

Silane modified polymers

Polymer ST, TEGOPAC®

Functional filler dispersants

TEGOPREN®, TEGOMER®

Thermoplastic resins

Functional filler dispersants

TEGOPREN®, TEGOMER®